Radar RF Circuit Design, Second Edition

This new edition of a previous bestseller gives you practical techniques for optimizing RF and microwave circuits for applications in radar systems design, with an emphasis on current and emerging technologies. Completely updated with new material, the book shows you how to design RF components for radar systems and how to choose appropriate materials and packaging methods. It takes you through classic techniques, to the state of the art, and finally to emerging technologies. You will learn: How to design high-frequency circuits for use in radar applications How to integrate components while avoiding higher-level assembly issues and troubleshooting problems on the measurement bench How to properly simulate, build, assemble, and test high-frequency circuits How to debug issues with hardware on the bench How to connect microwave theory to practical circuit design Theory and practical information are provided while addressing topics ranging from heat removal to digital circuit integration. The book serves as a teaching aid for classic techniques that are still relevant today. It also demonstrates how these techniques are serving as the foundation for technologies to come. You will be equipped to consider future needs and emerging enabling technologies and confidently think (and design) outside the box to ensure future needs are met. The book also shows you how to incorporate modern design techniques often overlooked or underused, and will help you to better understand the capabilities and limitations of today’s technology and the emerging technologies that are on the horizon to mitigate those limitations. This is a must-have resource for system-level radar designers who want to up their game in RF/microwave component design. It is also a great tool for RF/microwave engineers tasked or interested in designing components for radar systems. Students and new designers of radar components will also benefit and be well prepared to start designing immediately. Radar RF Circuit Design, Second Edition Contents Preface Acknowledgments 1 Crossing the Chasm from System to Component Level 1.1 Basic Radar Systems Overview 1.1.1 Radar Transmitters 1.1.2 Radar Receivers 1.1.3 Fundamental Equations 1.1.4 Requirements on Components 1.1.5 Radar Applications 1.2 Introduction to Microwave Components 1.2.1 Fundamental Equations 1.2.2 Essential Components 1.3 Traveling-Wave Tube Amplifiers Versus Solid-State Amplifiers 1.4 “How” Components Are Connected Matters 1.5 Anti-tamper Approaches Exercises References 2 Introduction to Microwave Design 2.1 Scattering Matrix 2.2 Matching Networks 2.2.1 Quantifying Mismatch 2.2.2 Graphically Based Circuits 2.2.3 Distributed Matching Networks 2.3 Methods of Propagation 2.3.1 Wave Modes 2.3.2 Coaxial Cables 2.3.3 Microstrip 2.3.4 Stripline 2.3.5 Coplanar Waveguide 2.3.6 Waveguide 2.3.7 Discontinuities 2.4 Material Selection 2.4.1 Semiconductors 2.4.2 Metals 2.4.3 Ceramics 2.4.4 Polymers 2.4.5 Substrates 2.4.6 New and Emerging Technologies Exercises References 3 Component Modeling 3.1 Passive Modeling 3.1.1 Capacitor 3.1.2 Inductor 3.1.3 Resistor 3.1.4 Resonators 3.2 Footprint Modeling 3.3 Transistor Modeling 3.3.1 Semiconductor Background 3.3.2 Basic Transistor Theory Review 3.3.3 Transistor Imperfections 3.4 Custom Models 3.5 Measurement Techniques 3.5.1 Small-Signal Measurement 3.5.2 Noise Measurement 3.5.3 Large-Signal Measurements 3.5.4 Load-Pull Measurement Exercises References 4 Power Amplifier 4.1 Amplifier Basics 4.1.1 Class A 4.1.2 Class B 4.1.3 Class AB 4.1.4 Class C 4.1.5 Harmonically Matched Classes 4.1.6 Do Classes Really Matter? 4.2 Design Strategies and Practices 4.2.1 Stability 4.2.2 Power and Gain 4.2.3 Efficiency 4.2.4 Gain Flattening 4.2.5 VSWR 4.2.6 Conjugate Matching 4.2.7 DC Bias Filtering 4.2.8 Multistage Amplifiers 4.3 Broadband Amplifiers 4.3.1 Multisection Matching 4.3.2 Balanced Amplifier 4.3.3 Push-Pull Amplifier 4.3.4 Distributed Amplifiers 4.4 Balancing Linearity and Efficiency 4.4.1 Explanation of Linearity 4.4.2 Doherty 4.4.3 Other Linearization Techniques 4.5 Multiphysics Concerns 4.5.1 Thermal Considerations 4.5.2 Mechanical Considerations 4.6 LOs 4.7 Tubes, Solid-State, and Where They Overlap Exercises References 5 LNAs 5.1 Explanation of Noise 5.1.1 Thermal Noise 5.1.2 Shot Noise 5.1.3 Flicker Noise 5.1.4 Noise Terminology 5.2 Transistor Noise Modeling 5.3 Design Strategies and Practices 5.3.1 Understanding Noise Circles 5.3.2 LNA Design 5.3.3 Self-Bias Scheme 5.3.4 Gain Equalizers 5.3.5 Resistor Component Selection 5.4 High Dynamic Range 5.5 Cryogenic Operation 5.6 Limiter Elimination Exercises References 6 Passive Circuitry 6.1 Limiting Factors and Ways to Mitigate 6.1.1 Lumped Elements 6.1.2 Bode-Fano Limit 6.1.3 Discontinuities 6.2 Couplers 6.3 Isolators and Circulators 6.4 Switches 6.5 Phase Shifters 6.6 Attenuators 6.7 Filters/Diplexers 6.8 Splitters/Combiners 6.9 Baluns 6.10 Mixers 6.10.1 Unbalanced or Single-Ended Mixer 6.10.2 Single-Balanced Mixer 6.10.3 Double-Balanced Mixer 6.10.4 Single-Sideband or Image-Rejection Mixer 6.10.5 IQ Mixer 6.11 Antennas 6.12 Current Density Analysis Exercises References 7 Microwave Integrated Circuits 7.1 Component Integration 7.1.1 MMIC 7.1.2 System-on-Chip 7.1.3 System-in-Package 7.1.4 Hybrid 7.1.5 Multichip Modules 7.1.6 Packaging Options 7.1.7 Substrate Stack-ups 7.1.8 Future Proofing Through Packaging 7.2 Packaging Model 7.3 Designing for U.S. Military Standards 7.3.1 Robustness 7.3.2 Operating Stability 7.3.3 Environmental Considerations 7.3.4 Electrical Considerations 7.3.5 Mechanical Considerations 7.4 Designing for Pulsed Radar 7.4.1 Radar Terminology 7.4.2 Component Design 7.5 Taking Advantage of Simulators 7.5.1 Passives 7.5.2 Actives 7.5.3 Full Electromagnetic Simulation 7.5.4 Manufacturing Assessment 7.6 Manufacturing Practices 7.6.1 Manufacturing Essentials 7.6.2 Engineering Practices for High Yield 7.6.3 Designing for MMIC-Level Cost Reduction 7.6.4 Designing for Module-Level Cost Reduction Exercises References 8 Transmit/Receive Module Integration 8.1 Integration Techniques 8.1.1 Physical Transitions 8.1.2 Wire and Ribbon Bonding 8.1.3 Proper Grounding 8.1.4 Achieving Compact Size 8.1.5 Component Placement 8.2 Preventing Oscillation 8.2.1 Even-Mode Oscillation 8.2.2 Odd-Mode Oscillation 8.2.3 Spurious Oscillation 8.2.4 Ground Loops 8.3 Preventing Crosstalk and Leakage 8.3.1 Electric Coupling 8.3.2 Magnetic Coupling 8.3.3 Shielding 8.3.4 Via Fence 8.4 Thermal Considerations 8.5 Mechanical Considerations 8.6 Module Simulation and Monte Carlo Analysis 8.7 Incorporating Digital into an RF Module 8.7.1 Common Digital Uses 8.7.2 Current Digital Infrastructure 8.7.3 DDS 8.7.4 Digital Radiation 8.7.5 Avoiding Mixed-Signal Issues 8.8 Power Management 8.8.1 Voltage Regulators 8.8.2 Power Management Integrated Circuit Exercises References 9 Assembly and Prototyping 9.1 Assembly Techniques 9.1.1 Automated Dispense 9.1.2 Pick and Place 9.1.3 Reflow Soldering 9.1.4 Rework Techniques 9.1.5 Wire Bonding 9.1.6 Inspection 9.2 SMT Versus Wire Bonding 9.3 Additive Manufacturing 9.4 PCB Considerations 9.4.1 PCB Stack-ups 9.4.2 Rolled Versus Electrodeposited Copper 9.4.3 Via Filling 9.4.4 Tombstoning 9.4.5 Metal Whiskers Exercises References 10 On the Measurement Bench 10.1 Measurement Uncertainty 10.2 Test Fixture Design 10.2.1 De-embedding Fixture Effects 10.2.2 Connectors, Adapters, and Cables 10.3 Bench Test Equipment 10.4 Calibration 10.4.1 SOLT Calibration 10.4.2 TRL Calibration 10.5 Tips for Making It All Work 10.5.1 Unstable Active Circuits 10.5.2 Incorrect Frequency Response 10.5.3 Radiation or Coupling 10.5.4 Low Gain or Output Power 10.5.5 High Loss 10.5.6 Catastrophic Damage at Initial Test 10.6 Transistor Stabilization Exercises References 11 Exploring Terahertz Radar 11.1 What Is Terahertz? 11.2 Applications at Terahertz 11.3 Terahertz Versus Microwave 11.4 Approaches for Tackling Terahertz 11.4.1 Downconvert from Optics 11.4.2 Design with Harmonics 11.4.3 Design with Rectangular Waveguides Exercises References Selected Bibliography Final Thoughts Acronyms About the Authors Index